The distance between AI and copper seems vast. On one side are cutting-edge algorithms running in the cloud; on the other is a traditional metal buried deep underground. But when AI runs, they become tightly connected. The high-speed computing of servers requires stronger power supply, faster data transmission, and more efficient cooling — and in all these areas, copper is essential. According to market estimates, the demand for high-end copper foil specifically for AI servers in 2026 is approximately 24,000 tons, representing a year-on-year increase of about 260%.
Needing more copper, and also 'finer' copper. A standard server typically requires only a few kilograms of copper, while a high-performance server used for AI training can consume 15 to 30 kg of copper per unit — three to six times that of a regular server. As liquid cooling accelerates its adoption, copper with excellent thermal conductivity is being increasingly used in cooling components such as liquid cooling plates.
In Yingtan, Jiangxi Province, a copper processing company's production lines run 24 hours a day, with orders already scheduled through year-end. The company's products are mainly applied to AI computing power chip liquid cooling plates, with monthly output exceeding 2,000 tons and order volume growing 30% year on year.
Beyond cooling, AI servers also need to handle large volumes of high-speed data transmission, further raising requirements for copper material performance. In Chizhou, Anhui Province, a company produces ultra-low profile copper foil primarily used in AI server high-speed PCB boards, with surface roughness controlled within 2 microns and signal transmission speed improved by 70% compared to traditional copper foil.
Since the fourth quarter of last year, some high-end copper foil for computing power has been persistently in tight supply. Companies report that since last December, processing fees for certain high-end copper foil have risen 30% to 50%. This year, ultra-low profile copper foil for AI servers and high-speed computing equipment has risen approximately 10% to 30%.
According to market estimates, demand for high-end copper foil specifically for AI servers in 2026 is approximately 24,000 tons, a year-on-year increase of about 260%. This means that computing power growth brings not just increased copper consumption, but also a concentration of demand toward high thermal conductivity, high frequency and speed, and high-precision copper materials.
At the other end, high-end copper materials are accelerating their march overseas. According to data from China's General Administration of Customs, in the first six months of this year, China's exports of copper materials reached 554,500 tons, up 25.8% year on year; copper foil exports reached 93,000 tons, up 31.4% year on year. One Anhui copper foil company's overseas export volume grew over 230% year on year. A Jiangxi company's high-end liquid cooling products now account for approximately 60% of export orders.
Experts at the Copper Industry Branch of the China Nonferrous Metals Industry Association noted that China has already transitioned from a net importer to a net exporter of copper materials. In 2021, China's net copper material exports were approximately 100,000 tons; by 2025, this figure may have exceeded 500,000 tons. By both importing resources overseas and selling more high value-added copper materials abroad, China's copper industry chain's security capacity and international competitiveness are simultaneously improving.
