Wall Street CN's September 16 morning brief reported that Huawei released the world's first 3D data-center architecture built on 100,000-card super-node clusters. By decoupling cooling, IT and power supply into layered, stacked modules, it lifts heat, power and expansion efficiency, with electromechanical prefabrication above 90% and delivery cut from six to three months. Huawei said its priority is lowering end-to-end AI-compute cost and accelerating chip adoption; board watchdog Guo Ping called AI Huawei's biggest opportunity and said ICT and compute aim to become "the Nvidia."
ByteDance is reorganizing its AI office: Doubao, Feishu and Volcano Engine merge into one enterprise-intelligence platform where Agent, model and collaboration form a trinity. Feishu 8.0 opened interfaces from 247 to 767, and Agents are upgraded to team members with independent identities embedded in collaboration flows. The "Doubao phone" (Nubia NaviX Ultra) went on sale September 16 with voice wake-up, on-screen Q&A, local memory retrieval and task automation; IDC forecasts 2026 China AI-phone shipments at 147 million, over 53% of the market.
MediaTek launched the first 2 nm flagship mobile chip, Dimensity 9600 Pro, with vivo X500 Pro and OPPO Find X10 Pro Max as first adopters—underscoring how on-device AI is becoming a core growth vector.
Source: Wall Street CN
