On August 24, 2026, Xiaomi held its Xuanjie (Xring) chip technology communication conference, officially unveiling the Xring D100 — its first self-developed 3-nanometer AI driving chip. The D100 adopts a 6nm 3D wafer-level stacking solution with bandwidth reaching 1.22 TB/s. Architecturally, the chip employs a near-memory AI computing architecture paired with Xuanjie high-bandwidth matrix bus technology, supporting multi-core parallel computing. When running the Xiaomi MiMo 3B model, it achieves an inference speed of 330 tokens per second.
The launch represents Xiaomi's most ambitious step yet in its automotive vertical integration strategy. Since entering the automotive sector with the SU7 sedan, Xiaomi has rapidly expanded from vehicle manufacturing to intelligent driving systems, and now to chip design — a progression that mirrors the approach taken by industry leaders like Tesla and BYD.
Xiaomi's chip team revealed that the D100 is designed specifically for smart driving applications, with architectural optimizations for autonomous driving workloads including sensor fusion, real-time path planning, and behavioral prediction. The 3nm process node represents a significant leap from previous-generation automotive chips, enabling substantially improved performance-per-watt for thermally constrained in-vehicle deployments.
The company stated that the Xring D100 is targeting mass-market commercialization by 2027, with the chip expected to debut in Xiaomi's next-generation smart driving platform. Industry analysts noted that Xiaomi's chip development trajectory positions it as a full-stack automotive technology company capable of competing across hardware, software, and silicon — a rare capability in the global automotive industry.
Image: Smart electronics and technology. Source: Wikimedia Commons (Public Domain / CC0).
