At the China International Industry Fair's integrated-circuit exhibition in Shanghai, Chinese chip companies moved from supporting cast to center stage, showing capabilities from cloud-scale compute to on-device intelligence. First-time exhibitor Enflame Technology presented the ESL64-O, an orthogonal-architecture high-performance supernode co-developed with ZTE. Using Enflame's self-developed accelerator modules, the cable-free, high-density design cuts communication latency and improves thermal and signal integrity, and can support clustering at scales above 10,000 cards.
Enflame has independently iterated four chip architectures and five cloud AI chips, with a full stack spanning AI chips, accelerator cards and modules, intelligent computing systems, and the TopsRider software platform. Its "domestic chip and model adaptation optimization system" won an innovation award at the fair.
At the other end of the scale, IoT chip designer Rockchip exhibited the RK1828 edge AI coprocessor, which uses near-memory computing to run 3B- and 7B-parameter large models locally. Already in mass production, it has landed in tray inspection, humanoid robots and edge industrial-control scenarios — evidence that domestic silicon now spans the full spectrum from cloud clusters to the factory edge.
Source: Caiwen via 10jqka
